Partners

TECHNIKON (TEC) is a private independent Austrian SME with a highly specialized multinational team of 20+ engineers and scientists. It is dedicated to engineering services as well as the planning, assessment and coordination of large industry driven, international research projects. Technikon contributes in WP2 leading the task related to the project data management. TEC will coordinate the Data Management Plan and contribute to the implementation of the central platform. TEC will establish and maintain communication tools and further develop the target audiences, the communication plan, and create material to support dissemination events. TEC performs administrative tasks, oversee risk management activities, enables risk mitigation when needed, and monitors innovation activities.

SeeReal is a privately owned engineering company with 30 employees active in optical, electrical and software design and prototyping, IP development and partner projects in Dresden, Germany. The company develops Real Holographic 3D display technology and successfully tested several display prototypes, for flat-panel and Head-Up Displays. SeeReal also developed a proprietary, ultra-efficient hologram computation. The solution relies both on the algorithms and the architecture of the computing hardware. SeeReal has developed a portfolio of over 100 patent families with more than 550 local patents and applications in the field, including related technologies -more than 75% have been granted already. After several prior projects with LCD manufacturers and consumer brand companies, in 2018 SeeReal won a contract with Volkswagen to develop VW’s automotive Holographic 3D Head-Up and Flat-Panel Displays. In 2018, SeeReal was awarded the Frost & Sullivan Innovation Prize for Best Holographic Display. Business Model: Paid development projects, Licensing of designs and IP.

Based in Dresden, Fraunhofer Institute for Photonic Microsystems (IPMS) provides future-oriented solutions for industrial manufacturing and automation as well as medical technology for an improved quality of life. Over 350 IPMS scientists and engineers perform at the highest level of excellence in the fields of optical sensors and actuators, integrated circuits, wireless data communication and microelectronics. They develop innovative MEMS components and microelectronic assembly parts on 200 and 300 mm wafers in our two ultra-modern cleanrooms and complete them with the support of our cooperation partners at our four locations in Dresden, Cottbus and Erfurt. Fraunhofer IPMS has more than two decades of experience developing MMAs as well as suitable fabrication processes using standard wafer fabrication tools. Fraunhofer IPMS is one of the currently 72 independent institutions of the Fraunhofer Society for the Promotion of Applied Research, the leader for industry-related research in Europe.

nSilition is an independent, privately owned company specialising in the design of Integrated Circuits (ICs). nSilition is knowledgeable about the steps necessary from concept study to the qualification for production of an Application Specific IC (ASIC) or a System on a Chip (SoC) integrating advanced analog and digital functionalities. These ICs are often placed at the interface between the sensor or actuating element(s) and the computer/processor in charge of the signal processing. nSiltion also designs semiconductor IP blocks, often in the framework of more complete projets. In that area, nSilition develop and support for sales the following blocks: Standardized IP blocks for immediate integration; Customer specific IP block; Design of complete IC for Application Specific (ASICs) or for more standard IC (ASSP); Production of the designed ASICs or ASSP for the consumer.

OmniChip is a semiconductor and electronic devices company founded in 2013. Its two major areas of expertise are: Integrated circuits design and electronic devices design. In the design services area its main clients are large semiconductor companies and electronic devices manufacturers. The company offers its services mainly to the companies from EU countries. The company provides design services covering the whole IC design, PCB design and device design area -from idea and architecture concepts, through standards verification, schematic, creating rules, PCB layout, thermal verification, test in EMC/EMI laboratory (or any other required), and then further cost and manufacturability optimization of the project and final documentation and report.

Valeo is an automotive supplier to automakers worldwide. As a technology company, Valeo proposes innovative products and systems that contribute to the reduction of CO2 emissions and to the development of Intuitive Driving. In 2019, the group generated sales of 19.3 billion euros and invested 13% of its original equipment sales in Research and Development. Valeo operates 186 plants, 21 research centers, 38 development centers and 15 distribution platforms, and employs 113,600 people in 33 countries worldwide. The entity Valeo Comfort & Driving Assistance (Valeo CDA) is leading the development of innovative solutions for automated driving, for human-machine Interfaces and for connectivity, leading to the concept of Intuitive Driving. Within VCDA, the Product Group Interior Controls is in charge of the development and production of displays, head-up displays, switches, top column modules, dome modules, driver monitoring and interior monitoring systems for interior automotive applications. This product group manages the development cycle, from research to mass-market production for the automotive industry worldwide.

Sencio, founded in January, 2011 in Nijmegen, Netherlands, is an innovative package and assembly solutions design house for MEMS and sensors systems that bridge the gap between the sensor system and the application. Sencio’s plastic transfer moulding package solutions offer an optimized application of sensor systems for industrial, automotive, medical and space applications. Their functional packaging technologies range from exposed die, glass on die-molding up to multi-die chip packaging (SiP = System in Package or MCM = Multi Chip Module), among many others. nCapsulate (Freeform packaging) is a new level of encapsulation, which can be accurately shaped and adapted to the exact requirements of your application. Sencio can also embed electronics and mechanical elements using the nCapsulate -technology, offering a practical solution that simplifies system challenges like improved alignment, mounting and sealing features, increased measurement accuracy, greater thermal conductivity and improved efficiency.

X-FAB is a pure-play foundry for analog/mixed-signal semiconductor technologies with a clear focus on automotive, industrial and medical applications. As a foundry, X-FAB provides manufacturing and design support services to its customers that design analog/mixed-signal integrated circuits (ICs) and other semiconductor devices for use in their own products or the products of their customers. The company has a track record of more than 25 years as a supplier for the automotive industry and is the only European pure-play foundry to be included in the top ten worldwide players. X-FAB employs about 3,800 people worldwide with and runs six manufacturing sites in Germany, France, Malaysia and the USA. The company’s offering includes technologies for sensors, actuators and system-on-chip on modular CMOS, SOI and MEMS processes; flexible combination and integration of power, high-voltage, analog sensors and non-volatile memory features on the same chip. It also operates dedicated MEMS foundry operations at its German sites. For more information, please visit xfab.com.