Introduce yourself and tell us a bit about your background.
Oliver began his semiconductor career at National Semiconductor as a product application engineer. Here he gained both technical and customer expertise, working on everything from RF and software to full applications. He then went into product marketing at Dialog Semiconductor, where he led efforts to integrate DECT into internet access devices.
Ignas has been active in semiconductor assembly since 1984, when he started as a package development engineer at Philips Semiconductor Nijmegen. In 1991 he joined Eurasem with responsibility for developing special assembly solutions for various applications and has been heavily involved in the company’s successful technology developments including the exposed die molding process.
Sonia has an electrical engineer degree, a master in telecommunication and a Ph.D in Science and Technology of Information and Communications degrees. Before starting her carrier within Sencio, she worked many years in different scientific activities and mainly focused on opto-electrical systems and optical signal processing. She participated at numerous committees of Optics & Photonics of Tunisia.
What is your title and/or role in the project?
Oliver joined Sencio as CEO in March, 2014. He is also the inventor of DECT ULE. He joined the REALHOLO project as General Assembly representative member.
Ignas is responsible for Sencio’s business development, sales and marketing, and is also an active member of the SEMI MEMS-summit committee as well as of the steering committee of the SEMI special interest group ESiPAT. Ignas joined the REALHOLO project as a General Assembly deputy member.
Sonia is Sales Engineer for customized system assembly and packaging solutions at Sencio. Sonia joined the REALHOLO project, as a project support member.
What are your contributions to the project? (Specify what tasks you are responsible for)
With a global overview on the project, Oliver is responsible of leading all Sencio’s tasks on the project.
Ignas is responsible of the technical task of the project. He will lead the design and the development of the package solution for the REALHOLO project.
Sonia will support different activities of the project.
What challenges can you foresee in the project?
The major technical challenges to overcome are the high number of pins, high required accuracy, placement of the beam combiner, high power dissipation…
Sencio will work with a high-level team of experts on packaging to reach the ideal packaging solution to bridge the gap between the MEMS and the application.
How do you think the project outcome could affect our daily life?
We believe that the REALHOLO product is a smart idea for future applications. The outcome will be new knowledge, new expertise, a new way of thinking, most probably new assembly technologies and finally a product which will go at some point in volume production for the mass markets.