Newsletter Issue 4

The REALHOLO project made significant progress in developing a novel MMA-based SLM (Spatial Light Modulator) and demonstrating its capabilities in a real holographic MR (Mixed Reality) application.

• The CMOS backplane design and the challenging packaging substrate design was verified through extensive simulations and finalized with high quality.
• Progress was made in MEMS manufacturing with steady improvements in MMA chip qua- lity despite setbacks, with promising results and recent wafer lots yet to be characterized.
• The finalized actuator design now includes advanced features like a shield ring and optimi- zed geometrical parameters.

Nevertheless, some significant amendments and updates within the REALHOLO project were ongoing. These modifications are crucial for adapting to unforeseen circumstances and ensu- ring the continued success of the project. The ongoing automotive crisis has presented challenges that have impacted the REALHOLO project. Some operational challenges have necessitated a strategic decision to restructure the consortium. We welcome Holoeye and Realview Imaging into the consortium, introducing al- ternative use cases that align with the project‘s objectives. Additionally, Fraunhofer IPMS took on the role of the technical lead, ensuring continuity and expertise within the consortium.